| Autor: |
Katoh, Kohji, Ohe, Masayuki, Komatsu, Hiroshi, Motobe, Takeharu, Hattori, Takashi, Ueno, Takumi |
| Zdroj: |
ECS Transactions; April 2007, Vol. 6 Issue: 3 |
| Abstrakt: |
In this paper, new polyimide coating technologies will be reported that are useful for next generation semiconductor applications. Traditionally, polyimide materials (PI) have been used as stress buffer and rewiring cover layers to improve semiconductor reliability. However, over recent years, due to process cost reduction, conventional PI has gradually been replaced by photosensitive PI (PSPI). In order to meet the next generation semiconductor applications for stress buffer and packaging, photolithographic performance, Cu compatibility, thicker film thickness formability and low temperature cure are critical process properties that need to be addressed. Development of functional PSPI technologies at HDM to meet each of these needs will be discussed in this paper. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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