Using pattern analysis to improve wafer inspection flow
Autor: | Robinson, John C., Sendelbach, Matthew J., Lin, Hung-yu, Wang, Ethan, Sweis, Jason, Hurat, Philippe, Lai, Ya-Chieh, Pai, Yu-Chin, Fang, Ku, Li, Chin-Juan, Huang, Chia Wei, Chen, Jun-Ming, Cheng, Yung-Feng |
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Zdroj: | Proceedings of SPIE; May 2022, Vol. 12053 Issue: 1 p120531T-120531T-5, 1084785p |
Databáze: | Supplemental Index |
Externí odkaz: |