Using pattern analysis to improve wafer inspection flow

Autor: Robinson, John C., Sendelbach, Matthew J., Lin, Hung-yu, Wang, Ethan, Sweis, Jason, Hurat, Philippe, Lai, Ya-Chieh, Pai, Yu-Chin, Fang, Ku, Li, Chin-Juan, Huang, Chia Wei, Chen, Jun-Ming, Cheng, Yung-Feng
Zdroj: Proceedings of SPIE; May 2022, Vol. 12053 Issue: 1 p120531T-120531T-5, 1084785p
Databáze: Supplemental Index