| Autor: |
Bykova, L. E., Zharkov, S. M., Myagkov, V. G., Balashov, Yu. Yu., Patrin, G. S. |
| Zdroj: |
Physics of the Solid State; 20220101, Issue: Preprints p1-5, 5p |
| Abstrakt: |
Abstract: The formation of the Cu6Sn5intermetallic in Sn(55nm)/Cu(30nm) thin-film bilayers has been studied upon heating the film sample from room temperature to 300°C directly in a column of a transmission electron microscope in the electron diffraction mode with recording electron diffraction patterns. The thin films synthesized by the solid-state reaction have been found to be single-phase and consist of the η-Cu6Sn5hexagonal phase (95‒260°C). It has been suggested basing on the effective interdiffusion coefficient (5 × 10‒16m2/s) estimated in the course of the reaction that the main mechanism of the formation of the Cu6Sn5thin films is diffusion along grain boundaries and dislocations. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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