| Autor: |
Bachok, Zuraihana, Abas, Mohamad Aizat, Nazarudin, Muhammad Zaim Hanif, Zahiri, Saifulmajdy A., Mohd Sharif, Mohamad Fikri, Che Ani, Fakhrozi |
| Zdroj: |
Journal of Electronic Packaging; December 2021, Vol. 144 Issue: 4 p041018-041018, 1p |
| Abstrakt: |
Laser soldering is becoming more popular for soldering pin through-hole (PTH) components onto printed circuit boards (PCBs). Solder volume influences soldering joint reliability. However, it is difficult to accurately measure the effect of solder volume during the laser soldering process. The finite volume method (FVM) is used to simulate the molten solder flow in laser soldering to connect the through-hole capacitor onto the PCB in ansysfluent software. The simulation results reveal the effects of different SAC305 solder volumes on joining quality in terms of fillet shape formation, pressure, and velocity. The preferred solder volume is 1.517 mm3 with a filling time of 1.7 s, a temperature of 642 K, a hole diameter of 1.0 mm, a lead diameter of 0.5 mm and a PCB thickness of 1.20 mm, produces a fillet shape similar to a real sample of PTH laser soldering joint from the industry. This ideal volume was chosen with a suitable pressure and velocity to create a nice concave fillet shape and minimize voids during soldering. The pressure and velocity increase when the solder volume increases causing solidified solder to melt. The discrepancy between numerical and experimental values of fillet height is comparable, which inferred that the numerical model was well-validated. The good consistency between both results proves that the finite volume model will effectively predict the optimum solder volume. This opens up new opportunities for the optimization of the laser soldering parameters in the application of electronic manufacturing. |
| Databáze: |
Supplemental Index |
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