| Autor: |
Wu, Kepeng, Wade, Noboru, Yamada, Seiji, Miyahara, Kazuya |
| Zdroj: |
International Journal of Materials Research: Zeitschrift fuer Metallkunde; December 2021, Vol. 95 Issue: 3 p185-188, 4p |
| Abstrakt: |
The present authors [1] and Ochoa et al. [2, 3] indicated that the creep and rupture strengths of a Sn-3.5% Ag lead-free solder alloy are very much affected by the variation of the microstructure formed under different solidification and cooling rates after casting. In the present research, the cooling effect and microstructural effect on the creep and rupture strengths of the Sn-3.5% Ag alloy is further investigated. The effect of the reflow and flow joining process on the rupture life is also discussed. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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