| Autor: |
Chun Quan, Yong, Jongryang Joo, Jongryang Joo, Donggeun Jung, Donggeun Jung |
| Zdroj: |
Japanese Journal of Applied Physics; March 1999, Vol. 38 Issue: 3 p1356-1356, 1p |
| Abstrakt: |
Polymer-like organic thin films were deposited by plasma enhanced chemical vapor deposition (PECVD) using the para-xylene precursor. The effect of the plasma power on the dielectric constant and thermal stability was significant. As the plasma power was increased from 5 W to 60 W, the relative dielectric constant increased from 2.70 to 3.21. The film deposited at a higher plasma power showed higher thermal stability. The film deposited at 60 W was stable up to 450°C. All the deposited films were insulating under an applied field of ?1 MV/cm. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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