Ultra-Low Resistance Base Ohmic Contact with Pt/Ti/Pt/Au for High-fmaxAlGaAs/GaAs Heterojunction Bipolar Transistors

Autor: Sugiyama, Tohru, Kuriyama, Yasuhiko, Asaka, Masayuki, Iizuka, Norio, Torakichi Kobayashi, Torakichi Kobayashi, Masao Obara, Masao Obara
Zdroj: Japanese Journal of Applied Physics; January 1994, Vol. 33 Issue: 1 p786-786, 1p
Abstrakt: Ohmic contacts to 500-Å-thick p-Al0.1Ga0.9As layer formed with a Pt/Ti/Pt/Au metal system were investigated. An extremely low contact resistivity of 4.2×10-7? ·cm2was obtained. The contact resistance increased with the increment of the Pt thickness, because the thicker the intermetallic layer becomes the thinner the AlGaAs layer beneath it, which leads to a higher contact resistance. The optimum Pt thickness was around 50 Å. Moreover, this metal scheme was thermally stable at 350° C. A high fmaxof 160 GHz was obtained for AlGaAs/GaAs HBTs using Pt/Ti/Pt/Au base electrodes. A multiplexer (MUX) lC implemented with these high-fmaxHBTs operated properly up to 40 Gbps, the highest speed ever reported. This value was restricted by the measuring instrument capability.
Databáze: Supplemental Index