| Abstrakt: |
A new handling technique of ultrafine particles, called "ultrafine-particle beam deposition," was applied to the preparation of various films, such as of Ag, Au, Cu, Fe, Ni, Pt, Ta and W. The mechanism of deposition and coalescence of ultrafine particles is thought to be described by the diffusion process. The high surface activity of ultrafine particles was preserved in this handling technique, and the obtained films had low electric resistances close to those of corresponding bulk metals. |
