Autor: |
Hideshi Nomura, Hideshi Nomura, Masaya Asano, Masaya Asano |
Zdroj: |
Japanese Journal of Applied Physics; September 1993, Vol. 32 Issue: 9 p3933-3933, 1p |
Abstrakt: |
Polarized infrared spectroscopy was used to characterize molecular orientation in polyimide films deposited on silicon wafers. The films were constructed from a single polyimide having a rodlike molecular skeleton. The degree of in-plane orientation at the interface with the wafer in the film varied with film thickness. On the other hand, that at the surface was almost constant. As a result of the difference in the thermal coefficient of expansion related to the degree of in-plane orientation between the surface and interface regions, thick films curled after they were stripped off the wafers. This phenomenon was presumed to be caused by the variation in the amount of the residual solvent in the polyimide precursor film with film thickness before the thermal cycle for imidization. |
Databáze: |
Supplemental Index |
Externí odkaz: |
|