A Highly-Sensitive Dry Developable Resist
Autor: | Tsuda, Minoru, Oikawa, Setsuko, Yabuta, Mitsuo, Yokota, Akira, Nakane, Hisashi |
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Zdroj: | Japanese Journal of Applied Physics; February 1984, Vol. 23 Issue: 2 p259-259, 1p |
Abstrakt: | A highly-sensitive dry developable resist for a deep UV aligner is described. The exposure time required is 1-2 sec, and the resist thickness remaining after dry development is 80-90%. The mechanism giving the high sensitivity was elucidated theoretically. |
Databáze: | Supplemental Index |
Externí odkaz: |