A Highly-Sensitive Dry Developable Resist

Autor: Tsuda, Minoru, Oikawa, Setsuko, Yabuta, Mitsuo, Yokota, Akira, Nakane, Hisashi
Zdroj: Japanese Journal of Applied Physics; February 1984, Vol. 23 Issue: 2 p259-259, 1p
Abstrakt: A highly-sensitive dry developable resist for a deep UV aligner is described. The exposure time required is 1-2 sec, and the resist thickness remaining after dry development is 80-90%. The mechanism giving the high sensitivity was elucidated theoretically.
Databáze: Supplemental Index