Pattern-centric yield management approach with machine learning to detect and track defects with full chip coverage

Autor: Yuan, Chi-Min, Kim, Ryoung-Han, Zhang, Yu, Yu, Shirui, Liu, Jiaqi, Meng, Renyang, Yin, Long, Wang, Kai, Cai, Kun, Zhang, Xingdi, Song, Xinghua, Ren, Jiadong, Vikram, Abhishek, Yan, Changlian, Cheng, Guojie, Wang, Hui, Zhang, Qing, Liao, Wenkui
Zdroj: Proceedings of SPIE; April 2021, Vol. 11614 Issue: 1 p1161406-1161406-8
Databáze: Supplemental Index