Vision-based high speed wafer film thickness profile estimation with nonlinear regression

Autor: Katayama, Ryuichi, Takashima, Yuzuru, Cho, Doo-Hyun, Kim, Hyounggon, Son, Jaehyeon, Kim, Sung-Ha, Kim, Taejoong, Lee, Kwangsung
Zdroj: Proceedings of SPIE; August 2020, Vol. 11500 Issue: 1 p115000K-115000K-13, 11385014p
Databáze: Supplemental Index