Machine learning and hybrid metrology using HV-SEM and optical methods to monitor channel hole tilting in-line for 3D NAND wafer production

Autor: Adan, Ofer, Robinson, John C., Meng, Michael, Tu, Leeming, Mi, Jian, Zhou, Haydn, Zou, Xi
Zdroj: Proceedings of SPIE; March 2020, Vol. 11325 Issue: 1 p113250O-113250O-7, 1019258p
Databáze: Supplemental Index