Machine learning and hybrid metrology using HV-SEM and optical methods to monitor channel hole tilting in-line for 3D NAND wafer production
Autor: | Adan, Ofer, Robinson, John C., Meng, Michael, Tu, Leeming, Mi, Jian, Zhou, Haydn, Zou, Xi |
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Zdroj: | Proceedings of SPIE; March 2020, Vol. 11325 Issue: 1 p113250O-113250O-7, 1019258p |
Databáze: | Supplemental Index |
Externí odkaz: |