3D-NAND wafer process monitoring using high voltage SEM with auto e-beam tilt technology

Autor: Adan, Ofer, Robinson, John C., Tu, Leeming, Mi, Jian, Fan, Henry, Zhou, Haydn, Xiong, Felix, Tu, Louis, Chen, Gangyi, Shao, Chuanyu, Zhang, Long, Kubo, Shinji
Zdroj: Proceedings of SPIE; March 2020, Vol. 11325 Issue: 1 p113250L-113250L-8, 1019259p
Databáze: Supplemental Index