| Autor: |
Wostyn, Kurt L., Sano, Ichi, Eitoku, Atsuro, Janssens, Tom, Bearda, Twan, H, Leonardus, and, Leunissen |
| Zdroj: |
ECS Transactions; September 2007, Vol. 11 Issue: 2 p55-60, 6p |
| Abstrakt: |
Cleaning technologies employing physical forces (such as megasonic and high-velocity-aerosol cleaning) are usually evaluated by comparing the particle removal efficiency on blanket wafers with damage formation on fragile structures, typically gate stack type structures. However patterned wafers provide a much more realistic cleaning challenge. Particle removal efficiencies from trenches in micrometer dimension have been evaluated using high-velocity-aerosol cleaning. When using short cleaning times, a large decrease in cleaning efficiency is found for even modest pattern dimension. By extending the cleaning time, cleaning efficiencies comparable to blanket-wafer tests can be reached. Moreover, batch megasonic cleaning shows a similar decrease in performance as high-velocity-aerosol cleaning. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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