| Abstrakt: |
New materials and novel devices are continuing to expand in leveraging the unique capabilities of CMP. Thru silicon vias (TSV's) are being developed for advanced packaging to reduce parasitic losses and shrink form factors. Most TSV process flows rely on CMP at least once, often twice, during the fabrication sequence. Direct wafer bonding requires Angstrom-level smooth surfaces, but CMP can enable bonding of almost anything to almost anything else. In one unique application, CMP enables the formation of hermetically sealed cavities up to several square mm in area and several hundred microns deep. Polycrystalline diamond films can require extremely long polish times due to the intrinsic hardness and chemical inertness of diamond. An optimized CMP process achieves sub-nm roughness of certain kinds of polycrystalline diamond with reasonable polish times and enables fabrication of some very unique resonator designs. These and other new materials and novel applications represent emerging growth areas for CMP. |
