Polishing of Semiconductor Materials
| Autor: | Rhoades, Robert L. |
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| Zdroj: | ECS Transactions; November 2010, Vol. 27 Issue: 1 p1081-1085, 5p |
| Abstrakt: | Polishing has been the critical final step in prime wafer manufacturing since the beginning of the semiconductor IC industry nearly fifty years ago. Chemical mechanical planarization (CMP) is a very different type of polishing developed roughly twenty years ago for planarization and removal of thin films during device fabrication. A simplified comparison of the two processes is presented, including their respective consumables and equipment. As new applications are developed, both types of polishing must continue to evolve and adapt to changing requirements. |
| Databáze: | Supplemental Index |
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