| Autor: |
Harr, Kyoungmoo, Lee, Bae, Kim, Su, Park, Seungwook, Kim, Gu, Kweon, Youngdo |
| Zdroj: |
ECS Transactions; March 2012, Vol. 44 Issue: 1 p975-983, 9p |
| Abstrakt: |
With increasing market demands of electric products for smaller, thinner, and faster, printed circuit board (PCB) are pushed to accommodate these requirements. A PCB with low CTE and high elastic modulus could be an alternative to be able to meet the requirements needed for the next generation of high-performance microsystems. In this study, the board level reliability test was performed to evaluate solder joint reliability of low CTE PCB and conventional PCB. Solder joint could be generated the failure due to stresses induced by large coefficient of thermal expansion (CTE) mismatch between silicon and printed circuit board (PCB) under temperature variation. Also, in daily use portable devices such as cellular phones, PDAs, and MP3 players, it is common for them to be subjected to accidental drop impacts resulting in damage and hence failures. Therefore, the reliability performance of solder joints during temperature cycling and drop test is a key issue and it was focused to obtain the board level reliability of solder joint on low CTE PCB. After board level reliability test, cross-section SEM and OM was done to analyze fracture modes of solder joint reliability. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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