| Autor: |
Yang, Liu, Slabbekoorn, John, Honore, Mia, Stiers, Karen, Struyf, Herbert, Vereecken, Philippe M, Radisic, Aleksandar |
| Zdroj: |
ECS Transactions; May 2016, Vol. 72 Issue: 4 p145-152, 8p |
| Abstrakt: |
In this study a quick and cost-effective approach is developed to evaluate the micro-bump height uniformity on wafer level. Our numerical simulation of bump-height distribution uses experimentally measured i-e curve, and requires no explicit knowledge of the plating bath components. Theoretical predictions are well matched with results obtained for Cu micro-bumps plated on 300 mm wafers with Cu seeds of varying thickness. The method can be easily adapted to address the challenges of fabrication of multi-layered features and different cell and electrode geometries. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
|
