Thin Film Ag Masking for Deep Glass Micromachining

Autor: Wah, Hing, S, Daniel C., Aishah, Siti, Badaruddin, Mohamad, Shih, Aun
Zdroj: Electrochemical and Solid State Letters; November 2010, Vol. 13 Issue: 11 pH399-H402, 4p
Abstrakt: We report a single thin film and low cost masking material for deep, wet isotropic etching of glass in HF, which has applications in microfluidic devices and systems. With a 100 nm thin silver (Ag) mask, microcavities with an etch depth exceeding were achieved and, by further thickening the silver film to 300 nm, etch depths up to were observed. The thin film was deposited by evaporation and patterned in a mixture of nitric acid and deionized water at a ratio of 1:3. Silver had good adhesion to glass.
Databáze: Supplemental Index