Aspect-Independent Siliconglass Etching by Bosch Method

Autor: Alekseev, R.A., Alieva, Aleksandra I., Kucal, Ewelina
Zdroj: Key Engineering Materials; September 2019, Vol. 822 Issue: 1 p640-646, 7p
Abstrakt: The purpose of this work was to study and carry out glass etching of monocrystalline silicon using the Bosch method, acquaintance with the conditions of aspect-independent etching. The Bosch process was conducted using sulfur hexafluorideSF6 and perfluorocyclobutaneC4F8on OxfordInstrumentsPlasmaPro®Estrelas100. It was found that in order to level the problems that arise, it is necessary to vary the temporal relations of etching and passivation stages.
Databáze: Supplemental Index