The effect of Cl(I)−ions on kinetics and mechanism of anodic dissolution and cathodic deposition of copper

Autor: Stanković, Zvonimir D.
Zdroj: Electrochimica Acta; March 1984, Vol. 29 Issue: 3 p407-409, 3p
Abstrakt: The influence of Cl(I)−ions on kinetics and mechanism of anodic dissolution and cathodic deposition of copper in acidic sulfate was investigated. For this investigation the galvanostatic single-pulse method has been used. The results indicate that Cl(I)−ions change the exchange current density and transfer coefficients as determined from tafel analyses of the anodic and cathodic reactions.
Databáze: Supplemental Index