AlCu Pitting Prevention in Post Etch Cleaning

Autor: Votta, Annamaria, Morandi, Roberto, Ravasio, Marcello, Tagliabue, Giovanni, Pipia, Francesco, Alessandri, Mauro
Zdroj: Diffusion and Defect Data Part B: Solid State Phenomena; August 2018, Vol. 282 Issue: 1 p213-219, 7p
Abstrakt: Three different cases of wet polymer removal in presence of AlCu are described: namely a) oxide passivation opening, b) vias etch and c) pad patterning. The occurrence of pitting at such levels is analyzed and linked to halogens presence. Moving from these results, a proposal to limit such kind of defects is given, focusing on a trimmed DIW rinsing step and on a possible AlCu passivation through a plasma ashing process.
Databáze: Supplemental Index