Towards co-packaging of photonics and microelectronics in existing manufacturing facilities

Autor: Schröder, Henning, Chen, Ray T., Janta-Polczynski, Alexander, Cyr, Elaine, Bougie, Jerome, Drouin, Alain, Langlois, Richard, Childers, Darrell, Takenobu, Shotaro, Taira, Yoichi, Lichoulas, Ted W., Kamlapurkar, Swetha, Engelmann, Sebastian, Fortier, Paul, Boyer, Nicolas, Barwicz, Tymon
Zdroj: Proceedings of SPIE; February 2018, Vol. 10538 Issue: 1 p105380B-105380B-10, 10432631p
Databáze: Supplemental Index