| Autor: |
Zhao, Biyao, Hardin, Keith, Hosseinbeig, Ahmad, Cao, Ying S., Dikhaminjia, Nana, Kratzer, Zach, Fessler, John, Drewniak, James |
| Zdroj: |
IEEE Electromagnetic Compatibility Magazine; July 2017, Vol. 6 Issue: 3 p91-97, 7p |
| Abstrakt: |
A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at the pads of surface mounted integrated circuits. The capacitor is multi-layer ceramic capacitor (MLCC) that is a right cylindrical shape with via channels in the outer wall along the axis of the part. The capacitor called a Z-Directed component (ZDC) is then pressed into a hole in the PCB. The connections to the component are then made by the copper plating process similar to via hole construction. This new configuration dramatically improves the PDN performance of PCBs with fewer components than the conventional solution with SMD decoupling capacitors. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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