Suppression of the Forward Degradation in 4H-SiC PiN Diodes by Employing a Recombination-Enhanced Buffer Layer

Autor: Tawara, Takeshi, Miyazawa, Tetsuya, Ryo, Mina, Miyazato, Masaki, Fujimoto, Takumi, Takenaka, Kensuke, Matsunaga, Shinichiro, Miyajima, Masaaki, Otsuki, Akihiro, Yonezawa, Yoshiyuki, Kato, Tomohisa, Okumura, Hajime, Kimoto, Tsunenobu, Tsuchida, Hidekazu
Zdroj: Materials Science Forum; May 2017, Vol. 897 Issue: 1 p419-422, 4p
Abstrakt: Application of highly N-doped buffer layers or a (N+B)-doped buffer layer to PiN diodes to suppress the expansion of Shockley stacking faults (SSFs) from the epilayer/substrate interface was studied. These buffer layers showed very short minority carrier lifetimes of 30–200 ns at 250°C. The PiN diodes were fabricated with buffer layers of various thicknesses and were then tested under high current injection conditions of 600A/cm2. The thicker buffer layers with shorter minority carrier lifetimes demonstrated the suppression of SSFs expansion and thus that of diode degradation.
Databáze: Supplemental Index