Novel methodology to optimize wafer alignment to enhance 14nm on product overlay

Autor: Erdmann, Andreas, Kye, Jongwook, Samudrala, Pavan, Chung, Woong Jae, Subramany, Lokesh, Gao, Haiyong, Aung, Nyan, Oh, Seung Chul, Lee, Shawn, Delvigne, Erik, Minghetti, Blandine
Zdroj: Proceedings of SPIE; March 2017, Vol. 10147 Issue: 1 p101471U-101471U-6, 913246p
Databáze: Supplemental Index