| Autor: |
Mbanaso, Chimaobi, Butterbaugh, Jeffery W., Becker, David Scott, Printz, Wallace P., Rotondaro, Antonio L.P., Bassett, Derek W., Thomes, Gregory P., Schwab, Brent D., Rathman, Christina Ann, Lauerhaas, Jeffrey M. |
| Zdroj: |
Diffusion and Defect Data Part B: Solid State Phenomena; September 2016, Vol. 255 Issue: 1 p195-200, 6p |
| Abstrakt: |
The performance of a new cryogenic aerosol process was evaluated for cleaning nanoparticles and providing damage-free processing. Particle Removal Efficiency (PRE) tests conducted with wet deposited 40 nm, 30 nm and 18 nm silica particles on 300 mm wafers demonstrated cleaning efficiencies above 80%. Damage-free capability of the cryogenic aerosol process was evaluated with poly-silicon lines with an aspect ratio of approximately 9:1. These results highlight the potential of this new cryogenic aerosol to provide semiconductor device yield benefits by reducing small particulate contamination without causing pattern damage. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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