Design of a high-speed vertical transition in LTCC for interposers suitable for packaging photonic integrated circuits

Autor: Vivien, Laurent, Pavesi, Lorenzo, Pelli, Stefano, Jezzini, M. A., Marraccini, P. J., Peters, F. H.
Zdroj: Proceedings of SPIE; April 2016, Vol. 9891 Issue: 1 p98911R-98911R-10, 9792200p
Databáze: Supplemental Index