| Autor: |
Ervina Efzan, Mohd Noor, Al Bakri Abdullah, Mohd Mustafa |
| Zdroj: |
Key Engineering Materials; July 2016, Vol. 700 Issue: 1 p113-122, 10p |
| Abstrakt: |
In this paper, the effect of thermal aging to the Sn-Zn and Sn-Zn-Bi solders on Cu substrate was studied. Sn-Zn was chosen and the effect of addition of Bi was investigated in this work. In this research, Sn-9Zn and Sn-6Zn-4Bi were subjected to thermal aging for 24h, 72h, 120h at 75°C and 100°C respectively. Both solder shown increased of thickness intermetallic layer with increasing time. However, Sn-9Zn recorded higher increment of intermetallic layer compared to Sn-6Zn-4Bi. The hardness of solder joint on Cu substrate was decreased for both solders with increasing aging time. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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