| Autor: |
Ervina Efzan, Mohd Noor, Nur Faziera, Mhd Nasir |
| Zdroj: |
Materials Science Forum; May 2016, Vol. 857 Issue: 1 p22-25, 4p |
| Abstrakt: |
This paper reported the investigation on gallium, Ga addition into In-4.8Zn lead-free solder to improve its wettability performances. The effect of addition of Ga in In-4.8Zn solder alloy was studied. The results show with the addition of 0.5% Ga into the In-4.8Zn composition, the spreading area of In-4.8Zn-0.5Ga solder on copper increase between 35.71 and 43.75 %. Hence, as the spreading area increases, the contact angle decreased from between 22.09 to 39.71 %. Additionally, the addition of Ga as dopant increased the thickness of IMCs layer. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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