| Autor: |
SATO, Hisayoshi, O-Hori, Masanori, Nakayama, Kazuo |
| Zdroj: |
CIRP Annals - Manufacturing Technology; January 1982, Vol. 31 Issue: 1 p457-462, 6p |
| Abstrakt: |
Use of scanning electron microscope for the surface roughness measurement was successful investigated by higher resolution and by two dimensional measurement. Development of a high speed measurement system of surface roughness and that of Schmälz method to two dimensional measurement stimulated to overcome limit of the resolution due to wave length of the light source. Derect application of the scanning electron microscope (SEM) to measurement of the surface roughness has not been successful in spite of its potential to high resolution. In this investigation it was found through the observation of a standard test piece with cross section of triangular shape surface that the cross section for the electron beam scanning can be obtained by Integrating the signal which makes the image of the backscattered electrons. This characteristic was also calibrated by that the signal intensity is proportion to the inclination of the surface. It was also verified that use of symmetrically located two probes detecting the backscattered electrons assures wider range of Linear correlation between the inclination and the intensity of the backscattered electrons. The operational amplifier for the integral was especially equipped with the SEM, which made it possible to obtain two dimensional surface roughness by performing the integral for the respective scannings. Applications of this method to the surface of the test piece above mentioned, of an integrated electronic circuit, and of ground area was successful to show the results on CPT display. Measurement of elaborately attached surface with wave length of 2.55um showed that order of 2.001 μm max is possible as the resolution by magnification of 90,000. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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