Pressure Dependence of the Curing Behavior of Epoxy Resin

Autor: Nakamae, Katsuhiko, Nishino, Takashi, AiRu, Xu, Takatsuka, Kohro
Zdroj: Polymer Journal; October 1991, Vol. 23 Issue: 10 p1157-1162, 6p
Abstrakt: Epoxy resin of bisphenol A type/aromatic diamine system was cured under high pressure up to 1,000 MPa. Pressure dependence of the mechanical and thermal properties of cured epoxy resin was investigated. Mechanical properties such as Young’s modulus, tensile strength and elongation at break, and the glass transition temperature decreased with increasing curing pressure, though high pressure showed no effect on density. The swelling ratio of the cured resin with toluene increased with increasing curing pressure, and the IR absorption band assigned to epoxy group remained for the epoxy resin cured at high pressure. These results show that high curing pressure increases the glass transition temperature, restricts the diffusion and collision of molecules and the rate of curing reaction slow down. Poor mechanical and thermal properties for the epoxy resin cured under high pressure are considered to be due to insufficient curing of these resins.
Databáze: Supplemental Index