Electro-Less Ni-P Plating Coating of In Situ TiCp/Al-4.5wt.%Cu Vomposites

Autor: Liang, Yan Feng, Dong, Sheng Quan, Li, Gao Hong
Zdroj: Materials Science Forum; April 2015, Vol. 817 Issue: 1 p593-598, 6p
Abstrakt: In situ TiCp/Al-4.5wt.%Cu composites have been coated using an electro-less Ni-P plating technique. The morphology and composition of the plating coating have been examined by scanning electron microscopy, optical microscopy, and X-ray diffraction. The results indicated that the coating had a high-phosphorus amorphous microstructure. The coatings microstructures showed significantly changes when the citric acid concentration in the chemical bath was varied in the range 16-20g/L.
Databáze: Supplemental Index