Development of SiC Power Module and Loss Evaluation in DC-DC Converter Circuit Application

Autor: Funaki, Tsuyoshi, Yamamoto, Shuhei, Harada, Shin, Iizuka, Yuji, Fukuda, Kenji, Sugiki, Akio, Hiratani, Tatsuhiko, Kimura, Hiroshi, Saitou, Takao
Zdroj: Materials Science Forum; June 2015, Vol. 821 Issue: 1 p879-883, 5p
Abstrakt: The thermal management of power module is one of the key important issues for power conversion circuit design. SiC power module is expected to give less conduction and switching loss than conventional Si device, which enables to facilitate the thermal management of a power conversion circuit. This paper develops 2in1 Full-SiC power module and studies the applicability for 600V→300V, 15kW DC-DC buck converter. The feasible thermal design of SiC power module to serve rated operation of the converter circuit is discussed based on the elemental experiments. The developed full-SiC power module realized lower loss and smaller converter circuit than conventional-Si power module.
Databáze: Supplemental Index