| Autor: |
You, Fan, Huang, Yong Guang, Li, Ben |
| Zdroj: |
Applied Mechanics and Materials; January 2015, Vol. 713 Issue: 1 p103-106, 4p |
| Abstrakt: |
In order to improve the anti-vibration performance of the Ball Grid Array solder joints, its solid model is established in ANSYS. Analyzing the stress response under the shock and vibration environment by using the finite element method. Then discussing the stress response of solder joints with different diameters and different heights in the same shock and vibration environment of each location for providing the basis for anti-vibration design. The results show that the longer diameter and lower height solder joint is more favorable to improve its anti-vibration performance. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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