Adhesive strength of electroplated copper films
| Autor: | Seah, C. H., Mridha, S., Chan, L. H. |
|---|---|
| Zdroj: | Journal of Materials Processing Technology; 2001, Vol. 114 Issue: 3 p252-256, 5p |
| Databáze: | Supplemental Index |
| Externí odkaz: |
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| Autor: | Seah, C. H., Mridha, S., Chan, L. H. |
|---|---|
| Zdroj: | Journal of Materials Processing Technology; 2001, Vol. 114 Issue: 3 p252-256, 5p |
| Databáze: | Supplemental Index |
| Externí odkaz: |
|
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