| Autor: |
Zeitler, Jochen, Götze, Bernhard, Fischer, Christian, Franke, Jörg |
| Zdroj: |
Advanced Materials Research; September 2014, Vol. 1038 Issue: 1 p11-17, 7p |
| Abstrakt: |
Molded Interconnect Devices can be considered as attractive option for the integration of electronic functions into mechanical systems. While development methods and procedures reached high standards, CAD tools still drag behind. This paper focusses the necessary software structure for implementing of automated routing algorithms or other MID specific extensions into CAD tools. An innovative three-layer model will be introduced and explained in detail. This paper also describes a method for mapping electrical components on unfolded surfaces for the further implementation of the automated routing algorithms. |
| Databáze: |
Supplemental Index |
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