| Autor: |
Liu, Jian, Tang, Xiusheng, Liu, Yu, Yang, Ping |
| Zdroj: |
International Journal of Materials and Structural Integrity; January 2013, Vol. 7 Issue: 4 p241-250, 10p |
| Abstrakt: |
In this study, considering the package-on-package (POP) structure for different locations on the PCB board, the dynamic characteristics of the POP package are analysed using finite element method. The results show that the POP structure for different locations on the PCB board greatly affects the natural frequency of the entire electronic device. It is a basic work for the future study such as experiment tests, layout optimisation and structural design for the POP structure. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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