| Autor: |
Vitina, I., Pelece, I., Rubene, V., Belmane, V., Lubane, M., Krumina, A., Zarina, Z. |
| Zdroj: |
Journal of Adhesion Science and Technology; January 1997, Vol. 11 Issue: 6 p835-860, 26p |
| Abstrakt: |
The structure of layers and formation of intermetallic phases after thermal treatment in the system of thin electrodeposited Sn, Ni-Fe and sputtered Cu, Fe-Ni layers (thickness 0.1-2.0 μm) and thick electrodeposited Sn (thickness 6-10 μm) and Fe-Ni and Ni-B layers (thickness 2 μm) have been investigated by means of scanning electron microscopy (SEM), transmission electron microscopy (TEM), and by metallographic and X-ray diffraction (XRD) techniques. The formation of intermetallic phases NiSn3, Ni3Sn2, FeSn2and considerable reduction in the formation of brittle layers Ni3Sn4, Cu6Sn5, Cu3Sn are determined by the structure and purity of electrodeposited tin [C (0.5-5) x 10-2; N (1-5) x 10-2; Fe, Cu, Bi, Pb (0.15-5.0) x 10-2wt%] in the system Sn/Fe-Ni/Cu. Electrodeposited Fe-Ni (80% Ni) as barrier layer in the system Sn/Fe-Ni/sputtered Cu completely prevents formation of Cu6Sn5, Cu3Sn as a result of thermal treatment at 170°C up to 75 h. An amorphous Ni-B layer [B 4-8; C (3-7) x 10-2wt%] prevents formation of Ni3Sn4and Cu6Sn5in the system Sn/Ni-B/Cu (or Cu-Zn alloy) as a result of thermal treatment at 130°C (200 h) and 170°C (150 h). |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
|
