Impact of pre-conditioning, voltage bias and temperature on reliability of plastic encapsulated microcircuits
| Autor: | Sharma, P., Upadhyayula, K., Lantz, L., Pecht, M. |
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| Zdroj: | Microelectronics Reliability; 1998, Vol. 38 Issue: 4 p581-584, 4p |
| Databáze: | Supplemental Index |
| Externí odkaz: |
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