The filling of via-holes by a sputtered AlSi alloy and the development of a two-level metallisation structure
| Autor: | Nahar, R. K., Devashrayee, N. M., Wadhawan, O. P., Vyas, P. D. |
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| Zdroj: | Microelectronics Reliability; 1993, Vol. 33 Issue: 2 p143-143, 1p |
| Databáze: | Supplemental Index |
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