| Abstrakt: |
The determination of the characteristics and properties of thin films deposited on substrates is necessary in any device application in various fields. Adequate mechanical properties are highly required for the majority of surface waves and semiconductor devices. In this context, modelling the ultrasonic-material interaction, we present results of simulation curves of acoustic signatures for multiple thin film/substrate combinations. The results obtained on several structures (Al, SiO2, ZnO, Cu, AlN, SiC and Cr)/(Al2O3, Si, Cu or Quartz) showed a velocity dispersion of the Rayleigh wave as a function of layer thickness. The development of a theoretical calculation model based on the acoustic behaviour of these structures has enabled us to quantify the dispersive evolution (positive and negative) density. Thus, we have established a universal relationship describing the density-thickness variation. In addition, networks of dispersion curves, representing the evolution of elasticity modulus (Young and shear), were determined. These charts can be used to extract the influence of thickness of layers on the variation of elastic constants |
