Autor: |
Izumi, Shigekazu, Yamamoto, Yoshitsugu, Kunii, Tetsuro, Miyakuni, Shinichi, Hayafuji, Norio, Sato, Kazuhiko, Otsubo, Mutsuyuki |
Zdroj: |
Journal of Crystal Growth; May 1997, Vol. 175 Issue: 1 p404-410, 7p |
Abstrakt: |
Selective area regrowth of silicon-doped GaAs has been successfully achieved by chemical beam epitaxy (CBE) on dry etched trench structures. Abrupt doping-interface and excellent doping controllability have also been achieved by using a novel silicon dopant source of silicon tetraiodide (SiI4). Metal-semiconductor field effect transistor (MESFET) and heterostructure field effect transistor (HFET) fabricated in this way with Ni/AuGe/Au alloyed contact contact metals on the Si-doped GaAs regrown layer reveal contact resistances as low as 3 × 10− 7Ω cm2and perfect selectivity there being no polycrystalline growth on the dielectric mask film. |
Databáze: |
Supplemental Index |
Externí odkaz: |
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