| Autor: |
Yorita, Chiko, Kobayashi, Tatsuya, Shohji, Ikuo |
| Zdroj: |
Key Engineering Materials; January 2011, Vol. 462 Issue: 1 p849-854, 6p |
| Abstrakt: |
Semiconductor packages that use metallization and lead-free solders are increasingly being used in electronic products. In this study, interface reactions and joint-strength reliability were investigated for Sn-3W%Ag-0.5W%Cu solder ball joints joined to Cr/Cu and Cr/Ni-40W% metallization layers that were heat treated at 260°C. The strength of the joint with the Cr/Cu metallization layer decreased as the duration of the heat treatment increased. Sn and Cr interface reactive layers were generated after the loss of Cu in the Cr/Cu metallization layer, but the connection was maintained. By contrast, the connection of the joint to the Cr/Ni-40W metallization layer was relatively stable under the heat treatment conditions investigated. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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