New Aqueous Clean for Aluminum Interconnects: Part II. Applications
| Autor: | Ravikumar, R., Rath, D.L., Delehanty, D.J., Filippi, R.G., Kiewra, E.W., Stojakovic, G., McCullough, K.J., Miura, D.D., Gambino, J., Schnabel, F., Rhoads, B.N. |
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| Zdroj: | Diffusion and Defect Data Part B: Solid State Phenomena; January 2001, Vol. 76 Issue: 1 p51-54, 4p |
| Abstrakt: | Not Available |
| Databáze: | Supplemental Index |
| Externí odkaz: |
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