Thermally Activated Flux Creep in High Tc Superconductors

Autor: Pande, C.S., Masumura, R.A., Feng, C.R.
Zdroj: Materials Science Forum; August 2003, Vol. 426 Issue: 1 p3493-3498, 6p
Abstrakt: Not Available
Databáze: Supplemental Index