AlN Deposition by OMVPE and PLD Used as an Encapsulate for Ion Implanted SiC

Autor: Jones, Kenneth A., Xie, K., Eckart, D.W., Wood, M.C., Talyansky, V., Vispute, R.D., Venkatesan, T., Wongchotigul, K., Spencer, Michael G.
Zdroj: Materials Science Forum; February 1998, Vol. 264 Issue: 1 p1243-1246, 4p
Abstrakt: Not Available
Databáze: Supplemental Index