AlN Deposition by OMVPE and PLD Used as an Encapsulate for Ion Implanted SiC
Autor: | Jones, Kenneth A., Xie, K., Eckart, D.W., Wood, M.C., Talyansky, V., Vispute, R.D., Venkatesan, T., Wongchotigul, K., Spencer, Michael G. |
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Zdroj: | Materials Science Forum; February 1998, Vol. 264 Issue: 1 p1243-1246, 4p |
Abstrakt: | Not Available |
Databáze: | Supplemental Index |
Externí odkaz: |