Heat transfer on mounting electronic components onto a printed circuit board

Autor: Prokopov, V. G., Fialko, N. M., Sarioglo, V. G., Grachev, A. A.
Zdroj: Journal of Engineering Physics and Thermophysics; August 1991, Vol. 61 Issue: 2 p959-964, 6p
Abstrakt: The results of mathematical modeling of nonlinear nonsteady heat-transfer processes in conditions of IR soldering of components onto printed circuit boards are outlined.
Databáze: Supplemental Index