Ohm resistivity of electroless copper layers as a function of their thicknesses

Autor: Radoeva, M., Radoev, B.
Zdroj: Journal of Materials Science; May 1995, Vol. 30 Issue: 9 p2215-2219, 5p
Abstrakt: The electric Ohm resistivity of electroless Cu depositions on dielectric substrates as a function of their thicknesses is studied. Substantial deviations (up to 10–20 times) from the standard resistivity (?8 = 1.7 µOcm-1) below 0.5 (µm thicknesses are observed. The experimental data show for the entire region of thicknesses (d8 ~ 0.07–5 µm) a power function between the relative resistivity changes (??/?8) and the inverse thickness of depositions (d8)-(??/?8 ~ (1/d8)0.8. This empirical relation is discussed as an effect of the porous structure of the metallic layers deposited on the substrate. A scanning electron micrography was applied in order to visualize the morphology of the depositions. The micrographs clearly show the evolution of the deposition profile: starting from separate islands at the very beginning of the process, and gradually covering the entire area with continuous but porous metal layers.
Databáze: Supplemental Index
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